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Temasek Laboratories@NTU is looking for a candidate to join them as a Research Associate. 

Our mission is to undertake cutting-edge research in defence science and technology, while pursuing new solutions and advancements in different research areas (e.g. Microsystems Technology, Hardware Assurance, Signal Processing, Advance Materials, Advance Laser Technology and Emerging Technologies).

We take huge pride in our people as we believe they are our greatest asset. We are committed to nurturing people and building their professional development. In addition, we support their personal aspirations and growth. We advocate a healthy work-life balance through yearly engagement and team bonding activities.

MTDC is looking to hire a dynamic candidate with strong hands-on experience to support fab back-end operation.

Key Responsibilities:

• Strong knowledge in overall wafer fabrication processes

• Self-initiator with effective Design of Experiment (DOE) to complete the work on time with conclusive remarks

• Continuous support and immediate feedback to its Module Leader (Back-end)/ Asst. Fab Manager

• Perform daily operations in back-end module, inclusive of back-lapping, back-grinding, Dicing and other backend processes

• Develop new recipe to cater for new project needs

• Maintain key inventories within the Back-end module

• Regular preventive maintenance of the back-end tools

• Data analysis and preparation of reports/slides after the completion of experiments.

• Create and update process documentation, maintenance and compliance of document

• Take care of metrology tools and perform yearly GRnRc

Job Requirements:

• Bachelor Degree (with minimum 4 years of relevant experience) in either Electrical & Electronics Engineering/ Material Science/ Physics/ Chemistry or Other related field

• Hands-on experience with strong knowledge and understanding in the area of Semiconductor wafer processes and its Devices

• Knowledge/experience/skills in more than two of these backend processes, back-lapping, back-grinding, sawing, dicing, scribing, wafer mounting and demounting, plating, die pick and place, die bonding, bond pull and bond shear, wire bonding

• Good interpersonal skills and ability to work independently and provide possible solution to the team by doing the designed experiments

We regret to inform that only shortlisted candidates will be notified.