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At Temasek Laboratories@NTU, our mission is to undertake cutting-edge research in defence science and technology, driving new solutions and advancements across various research areas, including Microsystems Technology, Hardware Assurance, Signal Processing, Advanced Materials, Advanced Laser Technology, and Emerging Technologies.

Microsystems Technology Development Centre (MTDC) at TL@NTU is having ISO certified III-V Wafer Fabrication Line up to 100-mm diameter wafers with strong industrial/academic experienced Technical Specialists/ Engineers/ Scientists. We are a fast-paced research facility that designs, develops, and manufactures integrated chips, i.e. heterogeneous system in package modules, for defence and commercial applications.

We are looking for a hands-on Etch process Research Associate who demonstrates a positive attitude, collaborates well in a team, and possesses strong technical abilities along with sound problem-solving skills.

Key Responsibilities:

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  Perform daily operations in back-end module, inclusive of back-lapping, back-grinding, Dicing and other backend processes.

  
  


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  Self-initiator with effective Design of Experiment (DOE) to complete the work on time with conclusive remarks.

  
  


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  Maintain detailed documentation of processes such as standard operating procedure (SOP), experimental setups, and results for future reference and knowledge transfer and including training.

  
  


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  Oversee the operation of laboratory equipment and ensure proper functioning. Work with the equipment vendor to conduct routine maintenance, troubleshooting, and calibration of equipment to minimize downtime.

  
  


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  Work with the University’s procurement team to source and acquire necessary equipment. Evaluate and select vendors, ensuring equipment aligns with research requirements and budget constraints.

  
  


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  Adhere to laboratory safety protocols and ensure compliance with University and regulatory standards.

  
  


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  Collaborate with different modules and team members.

  
  


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  Communicate effectively with team members, providing updates on processes and status of equipment.

  
  

Job Requirements:

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  Diploma in Engineering (e.g. Microelectronics, Electrical & Electronics Engineering, Material Engineering) with 8 years of relevant hands-on experience or Bachelor’s degree in engineering (e.g. Microelectronics, Electrical & Electronics Engineering, Material Engineering) with 5 years of relevant hands-on experience or Master’s degree in engineering (e.g. Microelectronics, Electrical & Electronics Engineering, Material Engineering) with 3 years of relevant hands-on experience.

  
  


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  Hands-on working experience in semiconductor fab/cleanroom environment in Backend process preferred.

  
  


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  Strong understanding on dicing and grinding process, with expertise in process optimization and troubleshooting.

  
  


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  Excellent problem-solving skills and ability to work effectively in a collaborative team environment.

  
  


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  Strong communication skills, with the ability to convey complex technical concepts clearly and concisely.

  
  


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  Commitment to maintaining high standards of safety, quality, and professionalism in all aspects of work.

  
  

We regret to inform that only shortlisted candidates will be notified.