Who's Who in
Engineering Academia

Yung-Cheng Lee

Academic Title: Professor

Administrative Title: Associate Director of NSF Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics

Name: Yung-Cheng Lee

Personal Website: http://sprocket.colorado.edu/%7Eleeyc/

 

Department: Mechanical Engineering

Department Website:

Institution: University of Colorado at Boulder

 

Address: 427 UCB
Boulder, Colorado 80309-0427

 

Highest Degree:

Date of Degree:

Degree Institution: University of Minnesota

 

E-mail: Contact by e-mail?

 

Expertise: Electronic packaging; optoelectronic packaging; low-cost prototyping and thermal management of multichip modules; 3-D packaging; solder self-alignment for precision alignments; solder joint reliability; thermosonic flip-chip bonding; process control using fuzzy logic modeling techniques.

 

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